ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,480,939, issued on Nov. 25, was assigned to STRATEDIGM INC. (San Jose, Calif.). "Multiplate conductor" was invented by Shervin Javadi (San Jose... Read More
ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,483,199, issued on Nov. 25, was assigned to RICHTEK TECHNOLOGY Corp. (Zhubei, Taiwan). "Amplifier circuit having low parasitic pole effect and ... Read More
ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,482,431, issued on Nov. 25, was assigned to Samsung Display Co. Ltd. (Gyeonggi-Do, South Korea). "Display apparatus" was invented by Byeong Soo... Read More
ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,479,771, issued on Nov. 25, was assigned to QuantumScape Battery Inc. (San Jose, Calif.). "Processes and materials for casting and sintering gr... Read More
ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,483,285, issued on Nov. 25, was assigned to MITSUBISHI ELECTRIC Corp. (Tokyo). "Communication apparatus" was invented by Shigenori Kitanaka (To... Read More
ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,481,686, issued on Nov. 25, was assigned to MCKINSEY & COMPANY INC. (New York). "Systems and methods for improved data curation and integration... Read More
ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,479,317, issued on Nov. 25, was assigned to DENSO Corp. (Kariya, Japan). "Vehicle power supply system" was invented by Kouji Mazaki (Kariya, Ja... Read More
ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,482,264, issued on Nov. 25. "System and method for engagement management" was invented by Brandon Fischer (Carmel, Ind.). According to the abs... Read More
ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,481,022, issued on Nov. 25, was assigned to KEYSIGHT TECHNOLOGIES INC. (Santa Rosa, Calif.). "System and method of emulating echo signals from ... Read More
ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,482,715, issued on Nov. 25, was assigned to XILINX INC. (San Jose, Calif.). "Chip package with core embedded integrated passive device" was inv... Read More