US Patent Issued to XILINX on Nov. 25 for "Chip package with core embedded integrated passive device" (Canadian, American Inventors)

ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,482,715, issued on Nov. 25, was assigned to XILINX INC. (San Jose, Calif.).

"Chip package with core embedded integrated passive device" was invented by Li-Sheng Weng (San Diego) and Alexander Helmut Pfeiffenberger (Toronto).

According to the abstract* released by the U.S. Patent & Trademark Office: "Chip packages are described herein that includes integrated passive devices embedded in a core of a substrate of the chip package, such as a package substrate or an interposer, that shield routings coupled to inductors from adjacent through-substrate conductive paths (e.g., vias). In one example, a chip package includes an integrated circuit (IC) die mounted to a substrate. A core of the ...