INTERNATIONAL PATENT: KOMATSU LTD., 株式会社小松製作所 FILES APPLICATION FOR "MOTOR DEVICE AND METHOD FOR MANUFACTURING MOTOR DEVICE"

GENEVA, Feb. 17 -- KOMATSU LTD. (1-2-20, Kaigan, Minato-ku, Tokyo1058316), 株式会社小松製作所 (東京都港区海&#2... Read More

INTERNATIONAL PATENT: ROHM CO., LTD., ローム株式会社 FILES APPLICATION FOR "SEMICONDUCTOR LASER ELEMENT"

GENEVA, Feb. 17 -- ROHM CO., LTD. (21, Saiin Mizosaki-cho, Ukyo-ku, Kyoto-shi, Kyoto6158585), ローム株式会社 (京都府京都市... Read More

INTERNATIONAL PATENT: MURATA MANUFACTURING CO., LTD., 株式会社村田製作所 FILES APPLICATION FOR "ELASTIC WAVE DEVICE"

GENEVA, Feb. 17 -- MURATA MANUFACTURING CO., LTD. (10-1, Higashikotari 1-chome, Nagaokakyo-shi, Kyoto6178555), 株式会社村田製作所 (京&#37117... Read More

INTERNATIONAL PATENT: SONY SEMICONDUCTOR SOLUTIONS CORPORATION, ソニーセミコンダクタソリューションズ株式会社 FILES APPLICATION FOR "LIGHT-EMITTING DEVICE AND IMAGE DISPLAY DEVICE"

GENEVA, Feb. 17 -- SONY SEMICONDUCTOR SOLUTIONS CORPORATION (4-14-1, Asahicho, Atsugi-shi, Kanagawa2430014), ソニーセミコンダクタソ&#1... Read More

INTERNATIONAL PATENT: MURATA MANUFACTURING CO., LTD., 株式会社村田製作所 FILES APPLICATION FOR "ELASTIC WAVE DEVICE"

GENEVA, Feb. 17 -- MURATA MANUFACTURING CO., LTD. (10-1, Higashikotari 1-chome, Nagaokakyo-shi, Kyoto6178555), 株式会社村田製作所 (京&#37117... Read More

INTERNATIONAL PATENT: NEC CORPORATION, 日本電気株式会社 FILES APPLICATION FOR "CONTROL DEVICE AND METHOD"

GENEVA, Feb. 17 -- NEC CORPORATION (7-1, Shiba 5-chome, Minato-ku, Tokyo1088001), 日本電気株式会社 (東京都港区芝&#20... Read More

INTERNATIONAL PATENT: MITSUBISHI ELECTRIC CORPORATION, 三菱電機株式会社 FILES APPLICATION FOR "JOINING METHOD, METHOD FOR MANUFACTURING COOLER, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, COOLER AND SEMICONDUCTOR DEVICE"

GENEVA, Feb. 17 -- MITSUBISHI ELECTRIC CORPORATION (7-3, Marunouchi 2-chome, Chiyoda-ku, Tokyo1008310), 三菱電機株式会社 (東京都&#2131... Read More

INTERNATIONAL PATENT: MAKINO MILLING MACHINE CO., LTD., 株式会社牧野フライス製作所 FILES APPLICATION FOR "METHOD FOR MEASURING WORK-AFFECTED LAYER OF WORKPIECE, METHOD FOR PROCESSING WORKPIECE, DEVICE FOR MEASURING WORK-AFFECTED LAYER AND MACHINE TOOL"

GENEVA, Feb. 17 -- MAKINO MILLING MACHINE CO., LTD. (3-19, Nakane 2-chome, Meguro-ku, Tokyo1528578), 株式会社牧野フライス製作&#2... Read More

INTERNATIONAL PATENT: NITTO DENKO CORPORATION, 日東電工株式会社 FILES APPLICATION FOR "ADHESIVE COMPOSITION, ADHESIVE SHEET AND BONDED BODY"

GENEVA, Feb. 17 -- NITTO DENKO CORPORATION (1-2, Shimohozumi 1-chome, Ibaraki-shi, Osaka5678680), 日東電工株式会社 (大阪府茨&#26... Read More

INTERNATIONAL PATENT: SEEDS INC., シーズ株式会社 FILES APPLICATION FOR "CURING CAPSULE AND CURING METHOD USING SAME"

GENEVA, Feb. 17 -- SEEDS INC. (7-4-1, Sanyo, Akaiwa-shi, Okayama7090827), シーズ株式会社 (岡山県赤磐市山陽&#65... Read More

• ««
• «
• 119530
• 119531
• 119532
• 119533
• 119534
• 119535
• 119536
• 119537
• 119538
• 119539
• »
• »»