ALEXANDRIA, Va., June 12 -- United States Patent no. 12,300,599, issued on May 13, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Method for forming semiconductor... Read More
ALEXANDRIA, Va., June 12 -- United States Patent no. 12,299,984, issued on May 13, was assigned to Comcast Cable Communications LLC (Philadelphia). "Systems, methods, and apparatuses for selecting/ge... Read More
ALEXANDRIA, Va., June 12 -- United States Patent no. 12,297,534, issued on May 13, was assigned to BASF SE (Ludwigshafen am Rhein, Germany) and Wayne State University (Detroit). "Process for the gene... Read More
ALEXANDRIA, Va., June 12 -- United States Patent no. 12,298,196, issued on May 13, was assigned to NextNav LLC (Sunnyvale, Calif.). "Systems and methods for determining when to calibrate a pressure s... Read More
ALEXANDRIA, Va., June 12 -- United States Patent no. 12,300,754, issued on May 13, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING Co. LTD (Hsinchu, Taiwan). "Channel configurations with stacked s... Read More
ALEXANDRIA, Va., June 12 -- United States Patent no. 12,297,138, issued on May 13, was assigned to CORNING Inc. (Corning, N.Y.). "Modular molten glass delivery apparatus" was invented by Gilbert De A... Read More
ALEXANDRIA, Va., June 12 -- United States Patent no. 12,296,159, issued on May 13, was assigned to Boston Scientific Scimed Inc. (Maple Grove, Minn.). "Method for pump start in a fully implanted LVAD... Read More
ALEXANDRIA, Va., June 12 -- United States Patent no. 12,302,700, issued on May 13, was assigned to Samsung Display Co. Ltd. (Yongin-si, South Korea). "Display apparatus, and apparatus for and method ... Read More
ALEXANDRIA, Va., June 12 -- United States Patent no. 12,300,440, issued on May 13, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea). "Multi-layer ceramic electronic componen... Read More
ALEXANDRIA, Va., June 12 -- United States Patent no. 12,302,494, issued on May 13, was assigned to NICHIA Corp. (Anan, Japan). "Lighting device with connection to element electrodes using filler" was... Read More