ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,472,384, issued on Nov. 18, was assigned to ViewRay Systems Inc. (Denver). "Radiation therapy systems and methods" was invented by Iwan Kawryko... Read More
ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,473,204, issued on Nov. 18. "Process for making synthetic minerals" was invented by Marie Claverie (Hassegor, France), Cyril Aymonier (Begles, ... Read More
ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,473,979, issued on Nov. 18, was assigned to EagleBurgmann Germany GmbH & Co. KG (Wolfratshausen, Germany). "Mechanical seal arrangement" was in... Read More
ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,475,757, issued on Nov. 18. "Deposit lock system and method for operating a deposit lock system for a loan object" was invented by Franz Wieth ... Read More
ALEXANDRIA, Va., Nov. 18 -- United States Patent no. D1,102,178, issued on Nov. 18. "Toilet paper holder" was invented by Donghan Wu (Heshan, China). The patent was filed on July 31, 2024, under App... Read More
ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,474,342, issued on Nov. 18, was assigned to Celgene Corp. (Summit, N.J.). "Methods for treating cancer and the use of biomarkers as a predictor... Read More
ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,476,224, issued on Nov. 18, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "3DIC interconnect apparatus and met... Read More
ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,474,456, issued on Nov. 18, was assigned to HYUNDAI MOBIS Co. LTD. (Seoul, South Korea). "Vehicle ultrasonic sensor control system and control ... Read More
ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,474,329, issued on Nov. 18, was assigned to Ares Trading S.A. (Aubonne, Switzerland). "Immunoassays for high positively charged proteins" was i... Read More
ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,476,214, issued on Nov. 18, was assigned to Intel Corp. (Santa Clara, Calif.). "Solder interconnect hierarchy for heterogeneous electronic devi... Read More