ALEXANDRIA, Va., Sept. 17 -- United States Patent no. D1,093,347, issued on Sept. 16. "Remote control" was invented by Yuechu Yan (Shenzhen, China). The patent was filed on May 15, 2024, under Appli... Read More
ALEXANDRIA, Va., Sept. 17 -- United States Patent no. 12,418,091, issued on Sept. 16, was assigned to NEC Corp. (Tokyo) and NEC Platforms Ltd. (Kanagawa, Japan). "Wireless communication unit and angl... Read More
ALEXANDRIA, Va., Sept. 17 -- United States Patent no. 12,418,075, issued on Sept. 16, was assigned to PANASONIC HOLDINGS Corp. (Osaka, Japan) and PANASONIC ENERGY Co. LTD. (Osaka, Japan). "Electrode ... Read More
ALEXANDRIA, Va., Sept. 17 -- United States Patent no. 12,414,759, issued on Sept. 16, was assigned to NewSouth Innovations Pty Ltd. (New South Wales, Australia). "Method and system for automatic 3D-F... Read More
ALEXANDRIA, Va., Sept. 17 -- United States Patent no. 12,414,515, issued on Sept. 16, was assigned to Pioneer Hi-Bred International Inc. (Johnston, Iowa). "Sorghum inbred PH3261MR" was invented by Hu... Read More
ALEXANDRIA, Va., Sept. 17 -- United States Patent no. 12,415,203, issued on Sept. 16, was assigned to Comau S.p.A. (Grugliasco, Italy). "System and method for automatically applying a bead of sealant... Read More
ALEXANDRIA, Va., Sept. 17 -- United States Patent no. 12,416,826, issued on Sept. 16, was assigned to Beijing BOE Display Technology Co. Ltd. (Beijing) and BOE Technology Group Co. Ltd. (Beijing). "S... Read More
ALEXANDRIA, Va., Sept. 17 -- United States Patent no. 12,415,383, issued on Sept. 16, was assigned to Hyundai Mobis Co. Ltd. (Seoul, South Korea). "Brake apparatus for vehicle" was invented by Sang P... Read More
ALEXANDRIA, Va., Sept. 17 -- United States Patent no. 12,414,719, issued on Sept. 16, was assigned to Heraeus Medical Components LLC (St. Paul, Minn.). "Segmented electrode and method" was invented b... Read More
ALEXANDRIA, Va., Sept. 17 -- United States Patent no. 12,417,971, issued on Sept. 16, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package with multilayer bond... Read More