Japan, Jan. 28 -- HUAWEI TECHNOLOGIES CO LTD has got intellectual property rights for 'HIGH-LEVEL SIGNALING METHOD AND APPARATUS FOR WEIGHTED PREDICTION.' Other related details are as follows: Applic... Read More
Japan, Jan. 28 -- UIT INC has got intellectual property rights for 'APPARATUS AND METHOD FOR DATABASE PREPROCESSING FOR UNCONVENTIONAL OIL PRODUCTION PLANT.' Other related details are as follows: App... Read More
Japan, Jan. 28 -- UNION TOOL CO has got intellectual property rights for 'ROLLING DIE SET.' Other related details are as follows: Application Number: JP,2023-214841 Category (FI): B21H1/00,B21H1/00@... Read More
Japan, Jan. 28 -- BANDAI NAMCO ENTERTAINMENT INC has got intellectual property rights for 'CONTENT DISTRIBUTION SYSTEM, SERVER SYSTEM, AND PROGRAM.' Other related details are as follows: Application ... Read More
Japan, Jan. 28 -- UNIVERSAL ENTERTAINMENT CORP has got intellectual property rights for 'GAME MACHINE.' Other related details are as follows: Application Number: JP,2023-211719 Category (FI): A63F5/... Read More
Japan, Jan. 28 -- K & G:KK has got intellectual property rights for 'VACUUM SPRINKLER SYSTEM.' Other related details are as follows: Application Number: JP,2023-210844 Category (FI): A62C37/00,A62C3... Read More
Japan, Jan. 28 -- NITTO DENKO CORP has got intellectual property rights for 'OPTICAL FILM PIECE AND METHOD FOR MANUFACTURING THE SAME.' Other related details are as follows: Application Number: JP,20... Read More
Japan, Jan. 28 -- TOWA CORP has got intellectual property rights for 'WATER CIRCULATION DEVICE, CUTTING DEVICE AND METHOD FOR MANUFACTURING CUT PRODUCT.' Other related details are as follows: Applica... Read More
Japan, Jan. 28 -- HPSP CO LTD has got intellectual property rights for 'HIGH-VOLTAGE SUBSTRATE PROCESSING DEVICE.' Other related details are as follows: Application Number: JP,2024-216297 Category (... Read More
Japan, Jan. 28 -- TOWA CORP has got intellectual property rights for 'INSPECTION DEVICE, CUTTING DEVICE, AND MANUFACTURING METHOD OF SEMICONDUCTOR COMPONENT.' Other related details are as follows: Ap... Read More