US Patent Issued to DEME Offshore BE on Nov. 4 for "Method for anchoring a hollow tubular element in a water bottom, and assembly of the tubular element and a closing body" (Belgian Inventors)

ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,460,367, issued on Nov. 4, was assigned to DEME Offshore BE NV (Zwijndrecht, Belgium). "Method for anchoring a hollow tubular element in a water... Read More

US Patent Issued to TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY on Nov. 4 for "Backlight board, backlight module, and display device" (Chinese Inventor)

ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,464,615, issued on Nov. 4, was assigned to TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY Co. LTD. (Shenzhen, China). "Backlight board, backlight mod... Read More

US Patent Issued to ASTRIX ASTRONAUTICS on Nov. 4 for "Inflatable structures of or for spacecraft" (New Zealander Inventors)

ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,459,674, issued on Nov. 4, was assigned to ASTRIX ASTRONAUTICS Ltd. (Auckland, New Zealand). "Inflatable structures of or for spacecraft" was in... Read More

US Patent Issued to Hitachi High-Tech on Nov. 4 for "Probe device" (Japanese Inventors)

ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,461,126, issued on Nov. 4, was assigned to Hitachi High-Tech Corp. (Tokyo). "Probe device" was invented by Naoki Samura (Tokyo) and Yasuhiko Nar... Read More

US Patent Issued to UNITED MICROELECTRONICS on Nov. 4 for "Method for fabricating semiconductor device including embedded magnetic resistance random access memory" (Taiwanese Inventors)

ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,464,953, issued on Nov. 4, was assigned to UNITED MICROELECTRONICS CORP. (Hsin-Chu, Taiwan). "Method for fabricating semiconductor device includ... Read More

US Patent Issued to Micron Technology on Nov. 4 for "Flexible interposer for semiconductor dies" (Singaporean Inventors)

ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,463,140, issued on Nov. 4, was assigned to Micron Technology Inc. (Boise, Idaho). "Flexible interposer for semiconductor dies" was invented by H... Read More

US Patent Issued to Tokyo Electron on Nov. 4 for "Placing table and substrate processing apparatus" (Japanese Inventors)

ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,463,022, issued on Nov. 4, was assigned to Tokyo Electron Ltd. (Tokyo). "Placing table and substrate processing apparatus" was invented by Yusuk... Read More

US Patent Issued to FEITIAN TECHNOLOGIES on Nov. 4 for "Method, apparatus, terminal device and medium for realizing OTG communication without plugging and unplugging" (Chinese Inventor)

ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,461,883, issued on Nov. 4, was assigned to FEITIAN TECHNOLOGIES Co. LTD. (Beijing). "Method, apparatus, terminal device and medium for realizing... Read More

US Patent Issued to NVIDIA on Nov. 4 for "Fluid inspection using machine learning" (Oregon, California, Washington Inventors)

ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,461,087, issued on Nov. 4, was assigned to NVIDIA Corp. (Santa Clara, Calif.). "Fluid inspection using machine learning" was invented by Ryan Ke... Read More

US Patent Issued to Helix Steel on Nov. 4 for "Twisted reinforcement fibers and method of making" (Michigan Inventor)

ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,459,865, issued on Nov. 4, was assigned to Helix Steel LLC (Ann Arbor, Mich.). "Twisted reinforcement fibers and method of making" was invented ... Read More

• ««
• «
• 22723
• 22724
• 22725
• 22726
• 22727
• 22728
• 22729
• 22730
• 22731
• 22732
• »
• »»