ALEXANDRIA, Va., Aug. 20 -- United States Patent no. 12,393,442, issued on Aug. 19, was assigned to QUALCOMM Inc. (San Diego). "Hardware co-ordination of resource management in distributed systems" w... Read More
ALEXANDRIA, Va., Aug. 20 -- United States Patent no. 12,393,867, issued on Aug. 19, was assigned to Apple Inc. (Cupertino, Calif.). "Execution of segmented machine learning models" was invented by Um... Read More
ALEXANDRIA, Va., Aug. 20 -- United States Patent no. 12,393,559, issued on Aug. 19, was assigned to ThoughtSpot Inc. (Mountain View, Calif.). "Automatic machine learning data modeling in a low-latenc... Read More
ALEXANDRIA, Va., Aug. 20 -- United States Patent no. 12,396,100, issued on Aug. 19, was assigned to UNIMICRON TECHNOLOGY CORP. (Taoyuan, Taiwan). "Circuit board structure and manufacturing method the... Read More
ALEXANDRIA, Va., Aug. 20 -- United States Patent no. D1,089,407, issued on Aug. 19. "Fidget pen" was invented by Zhiwei Wu (Guangdong, China). The patent was filed on Oct. 10, 2024, under Applicatio... Read More
ALEXANDRIA, Va., Aug. 20 -- United States Patent no. 12,393,420, issued on Aug. 19, was assigned to Siemens AG (Munich). "System and computer-implemented method for controlling a software development... Read More
ALEXANDRIA, Va., Aug. 20 -- United States Patent no. 12,394,702, issued on Aug. 19, was assigned to SHINKO ELECTRIC INDUSTRIES Co. LTD. (Nagano, Japan). "Wiring board" was invented by Takashi Nakajim... Read More
ALEXANDRIA, Va., Aug. 20 -- United States Patent no. 12,394,786, issued on Aug. 19, was assigned to SK On Co. Ltd. (Seoul, South Korea). "Electrode, secondary battery comprising electrode and method ... Read More
ALEXANDRIA, Va., Aug. 20 -- United States Patent no. 12,395,566, issued on Aug. 19, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Electronic device and method for providing p... Read More
ALEXANDRIA, Va., Aug. 20 -- United States Patent no. D1,089,525, issued on Aug. 19. "Filter element" was invented by Yanqiong Guo (Shiyan, China). The patent was filed on May 9, 2024, under Applicat... Read More