US Patent Issued to ZTE on June 24 for "Heat dissipation structure, heat dissipation component and mounting method therefor, and foldable terminal" (Chinese Inventor)

ALEXANDRIA, Va., June 25 -- United States Patent no. 12,342,505, issued on June 24, was assigned to ZTE Corp. (Shenzhen, China).

"Heat dissipation structure, heat dissipation component and mounting method therefor, and foldable terminal" was invented by Zhulin Huang (Shenzhen, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed are a heat dissipation structure, a heat dissipation component and a mounting method thereof, and a foldable terminal device. The heat dissipation structure may include: a plurality of elastic heat conduction units; and at least one layer of heat conduction mesh, the heat conduction mesh includes a plurality of interlaced mesh wires, each two interlaced mesh wires are rotat...