US Patent Issued to ZTE on Jan. 13 for "Heat dissipation assembly and heat dissipater" (Chinese Inventors)

ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,523,428, issued on Jan. 13, was assigned to ZTE Corp. (Shenzhen, China).

"Heat dissipation assembly and heat dissipater" was invented by Kaiwen Duan (Shenzhen, China), Shuai Li (Shenzhen, China), Xin Liu (Shenzhen, China), Fan Liu (Shenzhen, China), Zhidong Nie (Shenzhen, China), Yan Wang (Shenzhen, China) and Mingming Zhao (Shenzhen, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A heat dissipation assembly and a heat dissipator are disclosed. The heat dissipation assembly may include: a base plate bottom; a base plate cover connected to the base plate bottom and forming a heat collection cavity for concentrating heat; a turbulation component pro...