US Patent Issued to ZTE, Institute of Spacecraft System Engineering on Nov. 4 for "Heat dissipation apparatus and electronic device" (Chinese Inventors)

ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,464,674, issued on Nov. 4, was assigned to ZTE Corp. (Shenzhen, China) and Institute of Spacecraft System Engineering (Beijing).

"Heat dissipation apparatus and electronic device" was invented by Cheng Tao (Shenzhen, China), Yalong Wang (Beijing), Fan Liu (Shenzhen, China), Shuai Li (Shenzhen, China) and Xingang Yu (Beijing).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed are a heat dissipation apparatus and an electronic device. The heat dissipation apparatus may include: a cooling component, comprising at least two cooling plates in which a flow channel for containing a working medium is arranged; and a first tube, through which the cooling pla...