US Patent Issued to Zhuhai ACCESS Semiconductor on Sept. 16 for "Inductor-integrating embedded support frame and substrate, and manufacturing method thereof" (Chinese Inventors)

ALEXANDRIA, Va., Sept. 17 -- United States Patent no. 12,418,988, issued on Sept. 16, was assigned to Zhuhai ACCESS Semiconductor Co. Ltd. (Guangdong, China).

"Inductor-integrating embedded support frame and substrate, and manufacturing method thereof" was invented by Xianming Chen (Guangdong, China), Wenshi Wang (Guangdong, China), Lei Feng (Guangdong, China) and Benxia Huang (Guangdong, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "An inductor-integrating embedded support frame according to an embodiment of the present disclosure includes a core dielectric layer, a through-opening penetrating through the core dielectric layer, wherein the through-opening is used for embedding and installing a device...