US Patent Issued to ZHUHAI ACCESS SEMICONDUCTOR on Nov. 18 for "Embedded packaging structure and method for manufacturing the same" (Chinese Inventors)

ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,476,230, issued on Nov. 18, was assigned to ZHUHAI ACCESS SEMICONDUCTOR Co. LTD (Guangdong, China).

"Embedded packaging structure and method for manufacturing the same" was invented by Xianming Chen (Guangdong, China), Benxia Huang (Guangdong, China), Lei Feng (Guangdong, China), Lina Jiang (Guangdong, China), Bingsen Xie (Guangdong, China) and Jindong Feng (Guangdong, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "An embedded packaging structure according to an embodiment of the present disclosure includes an optical communication device embedded in a substrate, and a blocking wall surrounding the working face opening. The optical communication d...