ALEXANDRIA, Va., June 12 -- United States Patent no. 12,300,576, issued on May 13, was assigned to Zhuhai ACCESS Semiconductor Co. Ltd. (Guangdong, China).

"Cyclic cooling embedded packaging substrate and manufacturing method thereof" was invented by Xianming Chen (Guangdong, China), Yejie Hong (Guangdong, China), Benxia Huang (Guangdong, China) and Lei Feng (Guangdong, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A cyclic cooling embedded packaging substrate and a manufacturing method thereof are disclosed. The packaging substrate includes a dielectric material body, a chip, a first metal face, a second metal face and a first trace. The dielectric material body is provided with a packaging cavity, t...