US Patent Issued to Zhuhai ACCESS Semiconductor on April 15 for "Hybrid embedded packaging structure and manufacturing method thereof" (Chinese Inventors)

ALEXANDRIA, Va., June 5 -- United States Patent no. 12,278,227, issued on April 15, was assigned to Zhuhai ACCESS Semiconductor Co. Ltd. (Guangdong, China).

"Hybrid embedded packaging structure and manufacturing method thereof" was invented by Xianming Chen (Guangdong, China), Lei Feng (Guangdong, China), Benxia Huang (Guangdong, China) and Yejie Hong (Guangdong, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A hybrid embedded packaging structure and a manufacturing method thereof are disclosed. The structure includes: a substrate with a first insulating layer, a conductive copper column, a chip-embedded cavity and a first circuit layer; a first electronic device arranged inside the chip-embedded cavit...