US Patent Issued to Zhuhai ACCESS Semiconductor on April 15 for "Conductive substrate and carrier plate wiring structure with filtering function, and manufacturing method of same" (Chinese Inventors)

ALEXANDRIA, Va., June 5 -- United States Patent no. 12,279,377, issued on April 15, was assigned to Zhuhai ACCESS Semiconductor Co. Ltd (Guangdong, China).

"Conductive substrate and carrier plate wiring structure with filtering function, and manufacturing method of same" was invented by Xianming Chen (Guangdong, China), Xiaowei Xu (Guangdong, China), Gao Huang (Guangdong, China) and Benxia Huang (Guangdong, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A manufacturing method for a conductive substrate with a filtering function includes preparing a core layer and forming first and second conductive holes in the core layer, forming a sacrificial copper layer on the first conductive hole and on the core ...