US Patent Issued to Zhuhai ACCESS Semiconductor, NEXPERIA on Nov. 4 for "Package substrate manufacturing method" (Chinese Inventors)

ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,463,055, issued on Nov. 4, was assigned to Zhuhai ACCESS Semiconductor Co. Ltd. (Guangdong, China) and NEXPERIA B.V. (Nijmegen, Netherlands).

"Package substrate manufacturing method" was invented by Xianming Chen (Guangdong, China), Frank Burmeister (Guangdong, China), Lei Feng (Guangdong, China), Yujun Zhao (Guangdong, China), Benxia Huang (Guangdong, China), Jinxin Yi (Guangdong, China), Jindong Feng (Guangdong, China), Yuan Li (Guangdong, China), Lina Jiang (Guangdong, China), Edward Tena (Guangdong, China) and Wenshi Wang (Guangdong, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package substrate manufacturing method includes: providing a be...