US Patent Issued to Zhejiang University on Sept. 9 for "Two-dimensional high-entropy metal oxide assembly with high thermal conductivity and preparation method thereof" (Chinese Inventors)

ALEXANDRIA, Va., Sept. 10 -- United States Patent no. 12,410,066, issued on Sept. 9, was assigned to Zhejiang University (Hangzhou, China).

"Two-dimensional high-entropy metal oxide assembly with high thermal conductivity and preparation method thereof" was invented by Lingjie Zhang (Zhejiang, China), Weiwei Cai (Zhejiang, China) and Ningzhong Bao (Zhejiang, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure relates to the field of new materials, and aims at providing a two-dimensional high-entropy metal oxide assembly with high thermal conductivity and a preparation method thereof. The two-dimensional high-entropy metal oxide assembly with the high thermal conductivity has a molecul...