US Patent Issued to ZEUS on March 25 for "Wafer processing apparatus and wafer processing method" (South Korean Inventors)

ALEXANDRIA, Va., March 26 -- United States Patent no. 12,261,076, issued on March 25, was assigned to ZEUS Co. LTD. (Hwaseong-si, South Korea).

"Wafer processing apparatus and wafer processing method" was invented by Seung Dae Baek (Hwaseong-si, South Korea), Sung Yup Kim (Suwon-si, South Korea) and Jun Goo Park (Hwaseong-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A wafer processing apparatus of the present invention includes a first chamber unit in which a first wafer part including a retainer ring portion and a plurality of sawn first dies is processed, a second chamber unit in which a second wafer part including a wafer part or a carrier substrate is processed, and a third chamber unit...