ALEXANDRIA, Va., June 4 -- United States Patent no. 12,322,607, issued on June 3, was assigned to ZEUS Co. LTD. (Hwaseong-si, South Korea).
"Wafer processing apparatus and wafer processing method" was invented by Seung Dae Baek (Hwaseong-si, South Korea), Kuem Dong Heo (Ansan-si, South Korea), Kang Won Lee (Guri-si, South Korea) and Woon Kong (Cheonan-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A wafer processing apparatus of the present invention includes a suction nozzle configured to suction sludge from a cup housing, a flow line connected to the suction nozzle such that the sludge and a chemical solution flow therein, a suction tank connected to the flow line such that the sludge and t...