ALEXANDRIA, Va., June 25 -- United States Patent no. 12,341,052, issued on June 24, was assigned to ZEUS Co. LTD. (Hwaseong-si, South Korea).
"Wafer cleaning apparatus" was invented by Seung Dae Baek (Hwaseong-si, South Korea), Sung Yup Kim (Suwon-si, South Korea) and Nam Jin Kim (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A wafer cleaning apparatus of the present invention includes a vacuum chuck unit on which a wafer is mounted, and an ultrasonic cleaning module configured to spray a cleaning solution onto the wafer and apply ultrasonic waves to the cleaning solution to ultrasonically vibrate the cleaning solution."
The patent was filed on April 13, 2022, under Application No. 17...