US Patent Issued to Zerova Technologies Taiwan on Nov. 25 for "Method for forming silicon carbide module integrated structure" (Taiwanese Inventor)

ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,484,158, issued on Nov. 25, was assigned to Zerova Technologies Taiwan Ltd. (Tainan, Taiwan).

"Method for forming silicon carbide module integrated structure" was invented by Kao Ping Lo (Taoyuan, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for forming a silicon carbide module integrated structure includes a heat sink and a silicon carbide module, which is fixedly connected with the heat sink. The solder paste is arranged between the heat sink and the silicon carbide module, and the heat sink and the silicon carbide module are hot pressed through a welding process to weld the silicon carbide module and the heat sink together."

The pa...