ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,528,935, issued on Jan. 20, was assigned to ZEON Corp. (Tokyo).
"Latex composition for dip molding and dip-molded article" was invented by Kentaro Hayasaka (Tokyo) and Tomoya Taniyama (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "A latex composition for dip molding including a latex of a conjugated diene polymer (A) having a methyl ethyl ketone insolubles content of 50% by weight or less, and a latex of a polymer (B) having a methyl ethyl ketone insolubles content of 55% by weight or more."
The patent was filed on May 20, 2021, under Application No. 17/923,064.
*For further information, including images, charts and tables, please visit: http:/...