ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,435,245, issued on Oct. 7, was assigned to YUPO Corp. (Tokyo).
"Laminate and hot melt-type adhesive label" was invented by Takahiro Zama (Ibaraki, Japan) and Rika Watanabe (Ibaraki, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a laminate and a hot melt-type adhesive label that suppress curling due to swelling while having a pulp-paper feel. The laminate includes a porous substrate layer and an adhesive resin receiving layer on one side of the porous substrate layer, and the adhesive resin receiving layer contains an amorphous resin."
The patent was filed on Sept. 25, 2020, under Application No. 17/763,004.
*For further information, ...