US Patent Issued to YUPO on Dec. 16 for "Laminated body, heat-sensitive label, in-mold label and labeled container" (Japanese Inventor)

ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,499,783, issued on Dec. 16, was assigned to YUPO Corp. (Tokyo).

"Laminated body, heat-sensitive label, in-mold label and labeled container" was invented by Masahiko Ueno (Ibaraki, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a laminated body that has sufficient adhesive strength to an adherend and that is easy to peel off by high temperature water treatment. The laminated body has a substrate layer and a heat sealing layer (A). The heat sealing layer (A) is the outermost layer of the laminated body. The heat sealing layer (A) contains a heat sealing resin (a) and a water-soluble resin (c), and the mass ratio of the heat sealing resin...