US Patent Issued to YODOGAWA HU-TECH, CKD on Nov. 18 for "Fluid device coupler and fluid device coupling structure" (Japanese Inventors)

ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,474,001, issued on Nov. 18, was assigned to YODOGAWA HU-TECH Co. LTD. (Osaka, Japan) and CKD Corp. (Aichi, Japan).

"Fluid device coupler and fluid device coupling structure" was invented by Masao Iida (Suita, Japan) and Hiroki Iwata (Komaki, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention provides a fluid device coupler which can achieve satisfactory workability while saving space without reducing sealing performance, wherein the fluid device coupler comprises a coupling base having a depressed part at least partially curved in an arc shape, a first end edge side and a second end edge side continuous with an inner surface of t...