ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,534,426, issued on Jan. 27, was assigned to YMT Co. LTD. (Incheon, South Korea).
"Leveler and electroplating composition for filling via hole" was invented by Dea Geun Kim (Incheon, South Korea), Sung Wook Chun (Incheon, South Korea), Bo Mook Chung (Incheon, South Korea) and Nak Eun Ko (Bucheon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention relates to a leveler capable of efficiently filling the inside of via holes formed during the manufacturing process of a printed circuit board, and an electroplating composition comprising the same. When via holes on a substrate are filled with the electroplating composition acco...