ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,522,559, issued on Jan. 13, was assigned to YMT Co. LTD. (Incheon, South Korea).
"Leveling agent and electrolytic composition for filling via hole" was invented by Sung Wook Chun (Incheon, South Korea), Bo Mook Chung (Incheon, South Korea), Dea Geun Kim (Incheon, South Korea), Nak Eun Ko (Bucheon-si, South Korea) and Ju Yong Sim (Seoul, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention relates to a leveling agent and an electrolytic composition comprising the same. When the via hole in the substrate is filled with the electrolytic composition according to the present invention, the via hole can be filled within a relativel...