US Patent Issued to YMT on Dec. 9 for "Metal foil, carrier with metal foil comprising the same and printed circuit board including the same" (South Korean Inventors)

ALEXANDRIA, Va., Dec. 9 -- United States Patent no. 12,495,494, issued on Dec. 9, was assigned to YMT Co. LTD (Incheon, South Korea).

"Metal foil, carrier with metal foil comprising the same and printed circuit board including the same" was invented by Sung Wook Chun (Incheon, South Korea), Bo Mook Chung (Incheon, South Korea), Dea Geun Kim (Incheon, South Korea), Myong Hwan Park (Incheon, South Korea), Nak Eun Ko (Bucheon-si, South Korea) and Ju Yong Sim (Seoul, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention relates to a metal foil having a rough surface, a carrier-attached metal foil including the metal foil, and a printed circuit board manufactured using the metal foil. T...