ALEXANDRIA, Va., June 6 -- United States Patent no. 12,283,791, issued on April 22, was assigned to YLX Inc. (Shenzhen, China).
"Semiconductor laser chip and preparation method therefor" was invented by Chao-Chen Cheng (Shenzhen, China) and Anh Chuong Tran (Shenzhen, China).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor laser chip and a preparation method therefor, the method comprising: providing an epitaxial wafer (100), the epitaxial wafer (100) comprising a plurality of resonant cavities (110) arranged in parallel; providing a heat sink substrate (200); attaching the epitaxial wafer (100) to the heat sink substrate (200) so as to form a first chip semi-finished product (10); performing fir...