US Patent Issued to YKK AP on Nov. 25 for "Resin profile joining method and resin profile joining device" (Japanese Inventors)

ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,479,166, issued on Nov. 25, was assigned to YKK AP Inc. (Tokyo).

"Resin profile joining method and resin profile joining device" was invented by Isao Kobayashi (Tokyo) and Koji Matsuda (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a resin profile joining method of joining a pair of resin profiles. The method includes: holding one resin profile and another resin profile of the pair of resin profiles with a first mold and a second mold, respectively; heating the end surfaces of the pair of resin profiles in no contact with the end surfaces of the pair of resin profiles to melt the pair of resin profiles; after the heating, moving each ...