ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,523,090, issued on Jan. 13, was assigned to YKK AP Inc. (Tokyo).
"Resin profile joining method" was invented by Isao Kobayashi (Tokyo) and Koji Matsuda (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a resin profile joining method of joining a pair of resin profiles. The method includes: holding one resin profile and another resin profile of the pair of resin profiles with a first clamp and a second clamp, respectively, such that end surfaces of the pair of resin profiles are faced each other; heating the end surfaces of the pair of resin profiles in no contact with the end surfaces of the pair of resin profiles to melt the pair of res...