US Patent Issued to Yibu Semiconductor on Sept. 30 for "Chip package and method of forming chip packages" (Chinese Inventor)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,431,465, issued on Sept. 30, was assigned to Yibu Semiconductor Co. Ltd. (Shanghai).

"Chip package and method of forming chip packages" was invented by Weiping Li (Shanghai).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of forming a package comprises assembling at least one chip layer over a carrier substrate, the at least one chip layer including chip couplers and chips, each of the chips having a front side facing the carrier substrate and chip contacts formed on the front side, the couplers including first chip couplers, each of the first chip couplers having an upper side facing away from the carrier substrate and first bumps formed on the...