US Patent Issued to Yibu Semiconductor on Sept. 2 for "Chip package and method of forming chip packages" (Chinese Inventor)

ALEXANDRIA, Va., Sept. 3 -- United States Patent no. 12,406,964, issued on Sept. 2, was assigned to Yibu Semiconductor Co. Ltd. (Shanghai).

"Chip package and method of forming chip packages" was invented by Weiping Li (Shanghai).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of forming a package comprises forming a stack of chip layers on a carrier. The stack of chip layers including at least a first chip layer over the carrier and a second chip layer over the first chip layer. The first chip layer includes a plurality of first chips facing the carrier and a plurality of chip couplers. The second chip layer includes a plurality of second chips facing the first chip layer. The method further comprises...