US Patent Issued to Yibu Semiconductor on May 6 for "Method for forming chip packages and a chip package" (Chinese Inventor)

ALEXANDRIA, Va., June 10 -- United States Patent no. 12,293,986, issued on May 6, was assigned to Yibu Semiconductor Co. Ltd. (Shanghai).

"Method for forming chip packages and a chip package" was invented by Weiping Li (Shanghai).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present application provides a method for forming chip packages and a chip package. The method comprises arranging a plurality of interconnect devices at intervals on a surface of a carrier and assembling a plurality of chipsets over the interconnect devices. Each chipset comprises at least two chips electrically connected through an interconnect device. A front surface of each chip facing the carrier is provided with a plurality of ...