ALEXANDRIA, Va., July 16 -- United States Patent no. 12,362,327, issued on July 15, was assigned to Yibu Semiconductor Co. Ltd. (Shanghai).
"Method of forming packages of stacked chips" was invented by Weiping Li (Shanghai).
According to the abstract* released by the U.S. Patent & Trademark Office: "A method of forming a package is provided. The method comprises assembling on a carrier a stack of chip layers including a plurality of first chip layers and a second chip layer; encapsulating the stack of chip layers in a molding compound; removing the carrier to form a package main body; forming a redistribution layer on an exposed side of a first chip layer; and dividing the package main body to form a plurality of packages. Each first chip...