ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,557,706, issued on Feb. 17, was assigned to Yenrich Technology Corp. (Hsinchu, Taiwan) and Epistar Corp. (Hsinchu, Taiwan).
"Pixel package and manufacturing method thereof" was invented by Li-Yuan Huang (Hsinchu, Taiwan), Tzu-Hsiang Wang (Hsinchu, Taiwan), Chi-Chih Pu (Hsinchu, Taiwan), Ya-Wen Lin (Hsinchu, Taiwan), Pei-Yu Li (Hsinchu, Taiwan) and Hsiao-Pei Chiu (Hsinchu, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A pixel package includes a base material, a circuit structure, light-emitting semiconductor elements, a non-light-emitting semiconductor element, and a light-transmitting adhesive layer. The base material has an upper surface, a low...