ALEXANDRIA, Va., Sept. 3 -- United States Patent no. 12,408,277, issued on Sept. 2, was assigned to YAZAKI Corp. (Tokyo).
"Component-attached FPC manufacturing method" was invented by Hidehiko Shimizu (Makinohara, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A component-attached FPC manufacturing method for manufacturing a component-attached FPC in which a circuit component is solder-bonded to an FPC, includes an FPC forming step of forming an FPC that integrally includes an FPC body, an FPC arm portion branching off from the FPC body, a component mounting portion provided on an end portion of the FPC arm portion and on which the circuit component is mounted, and a bridge connecting the component mou...