ALEXANDRIA, Va., June 10 -- United States Patent no. 12,294,209, issued on May 6, was assigned to YAZAKI Corp. (Tokyo) and TOYOTA JIDOSHA K.K. (Aichi-ken, Japan).
"Resin molded component" was invented by Yusuke Tsutagawa (Makinohara, Japan), Yasuhiro Tanaka (Makinohara, Japan), Hiroaki Kodera (Susono, Japan), Norihiro Ushida (Numazu, Japan) and Hiroyuki Hattori (Okazaki, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A resin molded component includes a bus bar having conductivity, a conductive member including an insertion hole into which the bus bar is inserted along an axis line direction, a resin member covering the bus bar and insulating the bus bar and the conductive member, and a potting material...