US Patent Issued to YAYATECH on Dec. 9 for "Device of inspecting defects of wafer diced or aligned" (Taiwanese Inventor)

ALEXANDRIA, Va., Dec. 9 -- United States Patent no. 12,493,001, issued on Dec. 9, was assigned to YAYATECH Co. LTD. (Hsinchu, Taiwan).

"Device of inspecting defects of wafer diced or aligned" was invented by Chien-Cheng Chen (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A device of inspecting defects of a wafer diced or aligned, the wafer including, after being diced or aligned, a silicon wafer layer and a blue film affixed to the bottom of the silicon wafer layer, the device including: an immersion liquid detector having a casing, the casing having a transparent lid, allowing a liquid to flow through and fill between the blue film and the transparent lid; a lens assembly disposed in the ca...