ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,449,164, issued on Oct. 21, was assigned to YANMAR POWER TECHNOLOGY Co. LTD. (Osaka, Japan).
"Heat pump" was invented by Norihiro Okuda (Osaka, Japan), Sachie Tsujikawa (Osaka, Japan), Terunori Aikawa (Osaka, Japan) and Shingo Okada (Osaka, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A heat pump includes a first outdoor heat exchanger and a second outdoor heat exchanger which are mutually connected in parallel; a merge part at which refrigerant that has flown out from the first outdoor heat exchanger and the second outdoor heat exchanger is configured to merge; and a third outdoor heat exchanger that is connected to the merge part."
The patent...