ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,442,572, issued on Oct. 14, was assigned to YANMAR POWER TECHNOLOGY Co. LTD. (Osaka, Japan).
"Heat pump" was invented by Norihiro Okuda (Osaka, Japan), Terunori Aikawa (Osaka, Japan) and Hideshi Okada (Osaka, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A heat pump includes an indoor heat exchanger; an outdoor heat exchanger that is connected to the indoor heat exchanger; an accumulator that is connected to the outdoor heat exchanger; an evaporative heat exchanger that is provided between the outdoor heat exchanger and the accumulator; and a bypass circuit that that is configured to enable a refrigerant that has flowed out of the indoor heat exc...