ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,456,698, issued on Oct. 28, was assigned to Yangtze Memory Technologies Co. Ltd. (Wuhan, China).
"Pad structures for semiconductor devices" was invented by Yihuan Wang (Wuhan, China) and Mingkang Zhang (Wuhan, China).
According to the abstract* released by the U.S. Patent & Trademark Office: "Aspects of the disclosure provide a semiconductor device and a method to fabricate the semiconductor device. The semiconductor device includes a first die comprising a first contact structure formed on a face side of the first die. The semiconductor device includes a first semiconductor structure and a first pad structure that are disposed on a back side of the first die. The first semiconductor...