US Patent Issued to Yangtze Memory Technologies on Oct. 21 for "Wire bonding apparatus, wire bonding method and semiconductor device" (Chinese Inventor)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,451,459, issued on Oct. 21, was assigned to Yangtze Memory Technologies Co. Ltd. (Hubei, China).

"Wire bonding apparatus, wire bonding method and semiconductor device" was invented by Xuhui Wang (Wuhan, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure provides a wire bonding apparatus, a wire bonding method and a semiconductor device. The wire bonding apparatus includes: a wire tube for containing the wire and including a wire exit; a wire heating assembly located at a side of the wire exit; and a pre-shaping assembly located at a side of the wire tube and including a wire pre-pressing face; the pre-shaping assembly having a f...