ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,451,460, issued on Oct. 21, was assigned to YANGTZE MEMORY TECHNOLOGIES Co. LTD. (Wuhan, China).
"Wafer bonding apparatus and method" was invented by Guoliang Chen (Wuhan, China), Mengyong Liu (Wuhan, China), Yang Liu (Wuhan, China) and Wu Liu (Wuhan, China).
According to the abstract* released by the U.S. Patent & Trademark Office: "An apparatus for wafer bonding includes a first bearing table configured to hold a first wafer provided with at least one first alignment mark; a second bearing table, opposite to the first bearing table, and configured to hold a second wafer provided with at least one second alignment mark; an alignment component, located on at least a side of the first...