US Patent Issued to YANGTZE MEMORY TECHNOLOGIES on March 18 for "Dies, semiconductor package structures, enable pin configuration methods and memories" (Chinese Inventors)

ALEXANDRIA, Va., March 19 -- United States Patent no. 12,254,950, issued on March 18, was assigned to YANGTZE MEMORY TECHNOLOGIES Co. LTD. (Hubei, China).

"Dies, semiconductor package structures, enable pin configuration methods and memories" was invented by Yingjun Wu (Hubei, China), Huabin Yan (Hubei, China), Dong He (Hubei, China) and Lei You (Hubei, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "In one example, a peripheral circuit in a die is configured to: first, receive control commands, and generate indication information according to the control commands, the control commands being used for indicating the die to determine the address of the die, the indication information being used for indica...