US Patent Issued to YANGTZE MEMORY TECHNOLOGIES on June 17 for "Substrate structure, and fabrication and packaging methods thereof" (Chinese Inventors)

ALEXANDRIA, Va., June 19 -- United States Patent no. 12,334,361, issued on June 17, was assigned to YANGTZE MEMORY TECHNOLOGIES Co. LTD. (Wuhan, China).

"Substrate structure, and fabrication and packaging methods thereof" was invented by Xinru Zeng (Wuhan, China), Peng Chen (Wuhan, China) and Houde Zhou (Wuhan, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for fabricating a substrate structure for packaging includes providing a core substrate, a plurality of conductive pads at a first surface of the core substrate, and a metal layer at a second surface of the core substrate opposite to the first surface; forming a conductive structure, for pasting the substrate structure onto an external comp...