ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,479,135, issued on Nov. 25, was assigned to Yamaha Robotics Co. Ltd. (Tokyo).
"Resin-sealing method" was invented by Masahiko Fujisawa (Nagano, Japan) and Shinichi Asahi (Nagano, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A resin-sealing method for resin-sealing an electronic component using a mold-clamping apparatus provided with raising-lowering mechanisms including a first raising-lowering mechanism and a second raising-lowering mechanism includes steps below. A resin-sealed product obtained by resin-sealing is measured to measure a total thickness variation which is a difference between a maximum value and a minimum value of a thickness. A...