US Patent Issued to Yamaha Robotics on Nov. 18 for "Wire bonding state determination method and device using a prescribed electric waveform" (Japanese Inventors)

ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,476,219, issued on Nov. 18, was assigned to Yamaha Robotics Co. Ltd. (Tokyo).

"Wire bonding state determination method and device using a prescribed electric waveform" was invented by Hiroshi Munakata (Tokyo), Shota Nakano (Tokyo), Takuya Adachi (Tokyo), Choyekh Mahdi (Tokyo) and Landaez Ysmaldo (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a wire bonding state determination device which determines a bonding state between a pad and a wire after the wire is bonded to the pad. The wire bonding state determination device includes: a waveform detector which makes an incident wave incident to the wire, and detects a transmission waveform ...